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CO2 cleaning laser structuring

Removing ablation residues from laser direct structuring of MIDs

Removing ablation residues from laser direct structuring of 3-D printed circuit boards with an added effect Laser Direct Structuring (LDS) enables the circuit layouts of Molded Interconnect Devices (MIDs) to be produced on complex three-dimensional substrate structures. In the process, the laser beam inscribes the layout directly onto the injection-moulded plastic element. When removing ablation […]

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